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caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. hlmp-hg74/75, hlmp-hm74/75, hlmp-hb74/75 red, green and blue 5 mm standard oval leds data sheet description these precision optical performance oval leds are specifi cally designed for full color/video and passenger information signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide fi eld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains uv inhibitor to reduce the eff ects of long term exposure to direct sunlight. applications ? full color signs package dimensions package drawing a features ? well defi ned spatial radiation pattern ? high brightness material ? available in red, green and blue color C red alingap 626 nm C green ingan 530 nm C blue ingan 470 nm ? superior resistance to moisture ? standoff and non-standoff package ? tinted and diff used ? typical viewing angle 40 x100 package drawing b 5.20 0.204 1.02 0.040 max. 0.70 0.028 max. 7.00 0.275 25.00 0.984 min. sq. typ. 0.020 0.004 0.50 0.10 1.00 0.039 min. 2.54 0.10 3.80 0.150 measured at base of lens. cathode lead measured at base of lens. 5.20 0.20 0.205 0.008 10.80 0.50 0.425 0.020 7.00 0.20 0.276 0.008 1.30 0.20 0.051 0.008 1.02 0.040 max. 1.00 0.039 min. 24.00 0.945 min. sq typ. 0.50 0.10 0.020 0.004 0.70 0.028 max. refer to note 1 3.80 0.20 0.150 0.008 2.54 0.30 0.10 0.012 note 1. this dimension does not apply to red led cathode lead
2 device selection guide part number color and dominant wavelength d (nm) typ [3] luminous intensity iv (mcd) at 20 ma [1,2,5] standoff typical viewing angle () [4] package draw- ing min max hlmp-hg74-xy0dd red 626 1660 2400 no 40 x 100 a HLMP-HG75-XY0DD red 626 1660 2400 yes b hlmp-hm74-34bdd green 530 4200 6050 no a hlmp-hm75-34bdd green 530 4200 6050 yes b hlmp-hm74-34cdd green 530 4200 6050 no a hlmp-hm75-34cdd green 530 4200 6050 yes b hlmp-hb74-uvbdd blue 470 960 1380 no a hlmp-hb75-uvbdd blue 470 960 1380 yes b hlmp-hb74-uvcdd blue 470 960 1380 no a hlmp-hb75-uvcdd blue 470 960 1380 yes b notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. the optical axis is closely aligned with the package mechanical axis. 3. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 4. ? is the off -axis angle where the luminous intensity is half the on-axis intensity. 5. tolerance for each bin limit is 15%. part numbering system packaging option dd: ammopack color bin selection 0 : full distribution b : color bin 2 & 3 c : color bin 3 & 4 maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide standoff/non standoff 74: non standoff 75: standoff color g : red m : green b : blue package h: 5 mm standard oval 40 x 100 hlmp C h x xx C x x x xx
3 absolute maximum ratings t j = 25 c parameter red green/ blue unit dc forward current [1] 50 30 ma peak forward current 100 [2] 100 [3] ma power dissipation 120 114 mw led junction temperature 130 110 c operating temperature range -40 to +100 -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figures 4 and 8. 2. duty factor 30%, frequency 1 khz. 2. duty factor 10%, frequency 1 khz. electrical / optical characteristics t j = 25 c parameter symbol min. typ. max. units test conditions forward voltage red green blue v f 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 vi f = 20 ma reverse voltage [3] red green and blue v r 5 5 v i r = 100 a i r = 10 a dominant wavelength [1] red green blue d 618 523 464 626 530 470 630 535 476 nm i f = 20 ma peak wavelength red green blue peak 634 521 464 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-pin luminous effi cacy [2] red green blue v 218 538 65 lm/w emitted luminous power/ emitted radiant power notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. 2. the radiant intensity, i e in watts per steradian, may be found from the equation i e = i v / v where i v is the luminous intensity in candelas and v is the luminous effi cacy in lumens/watt. 3. indicates product fi nal testing condition. long term reverse bias is not recommended.
4 0 10 20 30 40 50 60 0 20406080100 t a - ambient temperature - c i f max - maximum forward current - ma 0 0.2 0.4 0.6 0.8 1 550 600 650 700 wavelength - nm relative intensity 0 20 40 60 80 100 0123 forward voltage - v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20406080100 dc forward current-ma relative luminous intensity (normalized at 20ma) forward current - ma alingap red figure 1. relative intensity vs wavelength f igure 2. forward current vs forward voltage figure 3. relative intensity vs forward current figure 4. maximum forward current vs ambient temperature
5 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0. 9 1 .0 380 430 480 530 580 630 w a vele ng th - n m r el a tive i n te ns ity gr ee n b l u e 0 20 40 60 80 1 00 0 1 2345 f or w ard v o lt ag e - v f or w ard curr e n t - ma 0.0 0.5 1 .0 1 .5 2.0 2.5 3.0 3.5 020406080 1 00 1 20 f or w ard curr e n t- ma r el a tive i n te ns ity ( norma li z e d a t 20ma ) - 8 - 6 - 4 - 2 0 2 4 6 020406080 1 00 1 20 f or w ard curr e n t- ma r el a tive dom i nan t w a vele ng th-n m g reen b lue b lue g reen 0 5 1 0 1 5 20 25 30 35 020406080 1 00 t a - amb ie n t te mp e ra t ur e - c i f - ma xi mum f or w ard curr e n t - ma ingan green and blue figure 5. relative intensity vs wavelength f igure 6. forward current vs forward voltage figure 7. relative intensity vs forward current figure 8. maximum forward current vs ambient temperature figure 9. relative dominant wavelength vs forward current
6 figure 10. radiation pattern-major axis figure11. radiation pattern-minor axis intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 tolerance for each bin limit is 15% figure12. relative light output vs junction temperature figure13. forward voltage shift vs junction temperature v f bin table (v at 20 ma) bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 notes: 1. tolerance for each bin limit is 0.05 v 2. v f binning only applicable to red color. 0.1 1 10 -40 -20 0 20 40 60 80 100 120 140 t j -junction temperature relative light output (normalized at t j = 25c) -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 -40 -20 0 20 40 60 80 100 120 140 t j -junction temperature forward voltage shift-v g ree n r e d blu e g ree n r e d blu e 0.0 0.2 0.4 0.6 0.8 1.0 - 9 0 -60 -30 0 30 60 9 0 angular dispalcement () normalized intensity r e d g ree n blu e r e d g ree n blu e 0.0 0.2 0.4 0.6 0.8 1.0 - 9 0 -60 -30 0 30 60 9 0 angular dispalcement () normalized intensity
7 avago color bin on cie 1931 chromaticity diagram blue color bin table bin min dom max dom 2 464 468 x 0.1374 0.1766 0.1699 0.1291 y 0.0374 0.0966 0.1062 0.0495 3 468 472 x 0.1291 0.1699 0.1616 0.1187 y 0.0495 0.1062 0.1209 0.0671 4 472 476 x 0.1187 0.1616 0.1517 0.1063 y 0.0671 0.1209 0.1423 0.0945 tolerance for each bin limit is 0.5 nm note: 1. all bin categories are established for classifi cation of products. products may not be available in all bin categories. please contact your avago representative for further information. green color bin table bin min dom max dom 2 523 527 x 0.0979 0.1450 0.1711 0.1305 y 0.8316 0.7319 0.7218 0.8189 3 527 531 x 0.1305 0.1711 0.1967 0.1625 y 0.8189 0.7218 0.7077 0.8012 4 531 535 x 0.1625 0.1967 0.2210 0.1929 y 0.8012 0.7077 0.6920 0.7816 tolerance for each bin limit is 0.5 nm red color range min dom max dom 618.0 630.0 x 0.6872 0.3126 0.6890 0.2943 y 0.6690 0.3149 0.7080 0.2920 tolerance for each bin limit is 0.5 nm 0.000 0.200 0.400 0.600 0.800 1 .000 0.000 0. 1 00 0.200 0.300 0.400 0. 500 0.600 0.700 0.800 y x g reen r e d b lue 2 2 3 3 4 4
8 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be eff ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59 mm. soldering the led using soldering iron tip closer than 1.59 mm might damage the led. 1.59mm alingap device cathode ingan device anode note: 1. pcb with diff erent size and design (component density) will have diff erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profi le again before loading a new type of pcb. 2. avago technologies allngap high brightness led are using high effi ciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260 c and the solder contact time does not exceeding 5 sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confi guration ? any alignment fi xture that is being applied during wave soldering should be loosely fi tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fi xture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refl ow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause diffi culty inserting the th led. refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. C preheat time 60 sec max C peak temperature 260 c max. 260 c max. dwell time 5 sec max. 5 sec max note: 1. above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2. it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and main- tained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profi le to ensure that it is always conforming to recommended soldering conditions.
9 ammo packs drawing note: all dimensions in millimeters (inches) example of wave soldering temperature profi le for th led recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255 c 5 c (maximum peak temperature = 260 c) dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 60 s e c max time (s e c) 260 c max 105 c max temperature ( c) cathode view a-a aa 6.35 1.30 0.25 0.0512 12.70 1.00 0.50 0.03 9 4 9 .125 0.625 0.35 9 3 0.0246 18.00 0.50 0.7087 0.01 9 7 12.70 0.30 0.50 0.0118 0.70 0.20 0.0276 0.007 9 4.00 0.20 0.1575 0.008 typ ? 20.50 1.00 0.8071 0.03 9 4
10 packaging box for ammo packs note: for ingan device, the ammo pack packaging box contain esd logo packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 260c label on this side of box from left side of box adhesive tape must be facing upwards. anode lead leaves the box first. + ?
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. av02-2725en - april 24, 2012 disclaimer: avagos products and software are not specifi cally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. acronyms and defi nition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max tem p 260c lam p s bab y label

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